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Introduced in 1998 and designed for silicon soft etch ( or dry cleaning ) providing productivity and low CoO/CoC performances. Featuring modular design of mainframe and two single type process chambers configured with downstream microwave module on top and RF bias on bottom of each process chamber. EcoLite2000 system provides a compact system design with high throughput and repeatability using Microwave and/or RIE plasma source. EcoLite2000 System provides Independent Process Control Sofware to be used different process for each chamber at the same time. EcoLite2000 system provides various applications for FEOL and BEOL. EcoLite2000 Specification System 6 ~ 8 Inch wafer Electrical requirement 208 VAC, 3 Phases, 5 Wires Temp. control range 20~80C¡¡ Dimension (mm) 890W x 1,900D x 1,970H Transfer system Two cassette stages, Dual arm robot Power Source Microwave ,RF Bias¡¡ Software Window NT base Throughput 120/Hour (Mechanical Throughput)¡¡ Process gas O2,N2, CF4 Application Photoresist Descum & Ashing, PBO & BCB Descum, N2 Milling,Surface Preparation, Etchback

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