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Introduced in 2001 and designed for various applications providing productivity and low CoO/CoC performances. Featuring modular design of mainframe and two single type process chambers configured with downstream microwave or ICP module on top and RF bias on bottom of each process chamber. EcoBump3000 system uses one robotic systems in order to transfer the wafers between FOUP to process chambers. The MASIC (Multi Axis Synchronized Interpolation Control) Robot in EFEM module provides robust hardware repeatability and production worthy. EcoBump3000 system provides a compact system design with high throughput and repeatability using Microwave or ICP and/or RIE plasma source. EcoBump3000 System provides Independent Process Control Sofware to be used different process for each chamber at the same time. EcoBump3000 system provides various applications like photoresist ashing & descum, PBO & BCB descum,N2 milling, etchback for FEOL and BEOL. EcoBump3000 Specification System 12 Inch wafer Electrical requirement 208 VAC, 3 Phases, 5 Wires Temp. control range 20~80C Dimension (mm) 1,235W x 1,990D x 2,050H Transfer system Two Load Ports, Dual arm robot Power Source Microwave or ICP ,RF Bias Software Window NT base Throughput 120/Hour (Mechanical Throughput) Process gas O2,N2, CF4 Application Photoresist Descum & Ashing, PBO & BCB Descum, N2 Milling,Surface Preparation, Etchback

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