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Introduced in 2003 and designed for etching & ashing applications for various damascene process , pad etch and etch back process .Also it has excellent productivity and low CoO/CoC. Featuring modular design of mainframe and it is consisted of two loadlock chambers and two process chambers. TE3000 uses two different robotic systems in order to transfer the wafers between FOUPs to process chambers. The MASIC (Multi Axis Synchronized Interpolation Control) Robot in EFEM module and advanced vacuum robot in transfer module that provide ultimate robust hardware repeatability and production worthy in 300mm applications. TE3000 system provides Less CAPEX for various applications. TE3000 Specification System 12 Inch wafer Electrical requirement 208 VAC, 3 Phases, 5 Wires Temp. control range 0~80C Dimension (mm) 1,235W x 3,300D x 2,050H Transfer system 1 MASIC Robot, 2 Vacuum Robots Power Source RIE or ICP Software Window NT base Throughput 100/Hour (Mechanical Throughput) Process gas 6 Gas channels Application Ashing for damascene , Pad Etch , Etc

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