This single-wafer process equipment enables high–aspect ratio contact cleaning and patterning in the semiconductor process by adjusting selectivity through a combination of chuck, baffle temperature, and various types of chemistry. It also provides isotropic etching and uniformity performance. This equipment has an advantage in throughput by transferring five wafers, and can realize high productivity with low CoO.

Via the batch-type loadlock system, 25 wafers are processed by elevators in two independent chambers. This loadlock system maintains an N2 atmosphere at all times while the wafers wait in the loadlock, and transfers 25 wafers at once to the load port after cooling, thereby minimizing exposure to air during the process, which is very beneficial for Q-Time.