Product

Dry strip equipment

With the greatest market share worldwide, the SUPRA product line enables stable dry strip processing through its proven performance, and was designed with the smallest footprint to provide higher T/P and lower CoO than conventional products. Through higher strip rate performance than other companies products, the improved PSK source provides superior wafer throughput and can safely remove photoresist with low plasma damage. In addition to bulk strip, we provide process solutions for various applications such as the improvement of HDIS process performance by using various types of chemistry, as well as metal layers and low-κ materials.

In addition to the innovative process improvements of the SUPRA products, system reliability is greatly improved through easy HW maintenance, field-proven customized software, and excellent operating time. We are developing dry strip processes to reduce PR residue, minimize oxidation and silicon loss, and ensure damage-free devices in order to meet the demands of advanced technologies.

Product line up
  • Product specification
  • High productivity
  • High strip rate
  • High realiability and low CoO
  • Product specification
  • High productivity
  • High strip rate by ATM wafer heating
  • High realiability low CoO
  • Excellent strip uniformity
  • Product specification
  • High productivity
  • High strip rate by ATM wafer heating
  • High realiability low CoO
  • Plasma damage free process by microwave source
  • Product specification
  • High productivity
  • Oxygen free process
  • Excellent defect performance
  • High dose ion implant strip
  • Strip process for metal & low- K  underlayer
  • Hard mask strip
  • Post etch strip/clean
  • Plasma & UV damage free
  • High reliability & low CoO